IF7: Electronics/ASICs

co-Conveners:

Description

Most R&D will need to be compatible with an extreme environment - e.g. high radiation, cryogenic, space. Current and future custom integration allows higher density, enhanced circuit performance, lower power consumption, lower mass, much greater radiation tolerance or cryogenic temperature performance than is possible with commercial ICs or discrete components. Designs that in the past required significant area on a printed circuit board with many types of specialized chips can potentially be replaced by a single integrated circuit and in some cases, notably pixel detectors, both sensor and readout can be fabricated as part of the same ASIC saving significantly on cost, power per channel and material burden, while improving spatial resolution and potentially replacing highly inefficient data transfer off detector with abstracted parameters.

Events

Past

Kickoff meeting 20200611

Upcoming

Workshop - Flashtalks 20200730

Useful Links

(Please let us know if you have suggestions to add!)

M/S pledge to end problematic and unnecessary language in technology: https://sites.google.com/view/mspledge

European Strategy Physics Book: https://cds.cern.ch/record/2691414/files/Briefing_Book_Final.pdf

CPAD 2018 Report: https://arxiv.org/pdf/1908.00194.pdf

Submitted LOI

Here is the list of submitted LOIs to this topical group. First index before “/” corresponds to the primary frontier used for the submission.